Reducing oxidation stress in the fabrication of devices

ABSTRACT

A random access memory cell having a trench capacitor formed below the surface of the substrate. A shallow trench isolation is provided to isolate the memory cell from other memory cells of a memory array. The shallow trench isolation includes a top surface raised above the substrate to reduce oxidation stress.

This is a continuation-in-part of U.S. Ser. No. 08/873,100, filed onJun. 11, 1997.

FIELD OF INVENTION

The invention generally relates to device fabrication such as randomaccess memories and, more particularly, to reducing oxidation stress atthe shallow trench isolation interface.

BACKGROUND OF INVENTION

In device fabrication, insulating, semiconducting, and conducting layersare formed on a substrate. The layers are patterned to create featuresand spaces. The minimum dimension or feature size (F) of the featuresand spaces depend on the resolution capability of the lithographicsystems. The features and spaces are patterned so as to form devices,such as transistors, capacitors, and resistors. These devices are theninterconnected to achieve a desired electrical function. The formationand patterning of the various device layers are achieved usingconventional fabrication techniques, such as oxidation, implantation,deposition, epitaxial growth of silicon, lithography, and etching. Suchtechniques are described in S. M. Sze, VLSI Technology, 2nd ed., NewYork, McGraw-Hill, 1988, which is herein incorporated by reference forall purposes.

Random access memories, such as dynamic random access memories (DRAMs),comprise memory cells that are configured in rows and columns to providestorage of information. One type of memory cells includes, for example,a transistor connected to a trench capacitor. Typically, the capacitorplate, which is connected to the transistor is referred to as the "node"when activated, the transistor allows information to be read or writteninto the capacitor.

Continued demand to device miniturization to have resulted in DRAMs withsmaller feature size and cell area. For example, reduction of theconventional cell area of 8F² towards and below 6F² have beeninvestigated. However, the fabrication of such small feature and cellsizes creates oxidation stress, where the node is isolated from thesubstrate. The oxidation stress, in turn, creates dislocations whichincreases the node junction leakage current. Such increases in nodeleakage current adversely impacts the performance and operability of thememory cells.

From the above discussion, it is apparent that there is a need to reduceoxidation stress that results during the fabrication of devices.

SUMMARY OF INVENTION

The invention generally relates the reduction of oxidation stress at thenode isolation region. In one embodiment, a random access memory cellimplemented with a trench capacitor is provided with a raised shallowtrench isolation. The trench capacitor, which is formed below the topsurface of a substrate, such as a silicon wafer, serves as the storagenode of the memory cell. The top surface of the raised shallow trenchisolation is raised above the top surface of the silicon substrate toeliminate sacrificial and gate oxidation stress. The amount that the topsurface of the shallow trench isolation is raised is sufficient toprevent the bottom of the divot formed during processing from beingbelow the silicon surface.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a conventional DRAM cell;

FIGS. 2a-g show the process for fabricating the conventional DRAM cellof FIG. 1;

FIG. 3 shows a DRAM cell in accordance with the invention; and

FIGS. 4a-4f show the process for fabricating the DRAM cell of FIG. 3;and

FIG. 5 shows a computer system employing a DRAM IC in accordance withthe invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to reducing oxidation stress during thefabrication of devices. For purposes of illustration, the presentinvention is described in the context of fabricating a trench capacitormemory cell. The memory cell is employed in an integrated circuit IC.Such IC or chip includes, for example, a random access memory (RAM), adynamic random access memory (DRAM), or a synchronous DRAM (SDRAM). TheIC can also be an application specific IC (ASIC), a merged DRAMlogiccircuit (embedded DRAM), or any other logic circuit.

Typically, numerous ICs are formed on the wafer in parallel. Afterprocessing is finish, the wafer is diced to separate the ICs toindividual chips. The chips are then packaged, resulting in a finalproduct that is used in, for example, consumer products such as computersystems, cellular phones, personal digital assistants (PDAs), and otherelectronic products.

To facilitate understanding of the invention, a description of thefabrication of a conventional trench capacitor DRAM cell is provided.

Referring to FIG. 1, a conventional trench capacitor DRAM cell 100 isshown. Such conventional trench capacitor DRAM cell is described in, forexample, Nesbit et al., A 0.6 μm² 256 Mb Trench DRAM Cell WithSelf-Aligned BuriEd Strap(BEST), IEDM 93-627, which is hereinincorporated by reference for all purposes. Typically an array of suchcells are interconnected by wordlines and bitlines to form a DRAM chip.

The DRAM cell comprises a trench capacitor 160 formed in a substrate101. Generally, the substrate is lightly doped with a dopant having afirst conductivity. The trench is filled with, typically, polysilicon(poly) 161 heavily doped with dopants having a second conductivity. Thepoly serves as one plate of the capacitor. The other plate of thecapacitor is formed by a buried plate 165, also having a secondconductivity.

The DRAM cell also comprises a transistor 110. The transistor includes agate 112, source 113, and drain 14. The drain and source are formed byimplanting dopants having a second conductivity. The designation of thedrain and source may change depending on the operation of thetransistor. For convenience, the terms drain and source areinterchangable. Connection of the transistor to the inner capacitorplate is achieved via a strap 125. The strap is formed by providingdopants having the same conductivity as the source. As shown, a buriedstrap is employed to connect the junction of the memory transistor tothe inner plate of the trench (node). Other techniques, such as asurface strap, for connecting the transistor to the capacitor are alsouseful. To prevent the punchthrough of the node junction into the buriedplate, a collar 168 is formed at a top portion of the trench.Punchthrough is undesirable as it affects the operability of the cell.

A buried well 170, also having dopants of the second conductivity, isprovided below the surface of the substrate with a peak concentration ofdopants at about the bottom of the collar. Typically, the well islightly doped. The buried well serves to connect the buried plates ofthe individual DRAM cells in the array together.

Generally, the gate and source form a wordline and bitline,respectively, in the DRAM array. Activation of the transistor byproviding the appropriate voltage at the wordline and bitline junctionenables data to be written or read from the trench capacitor. A shallowtrench isolation (STI) 180 is provided to isolate the DRAM cell fromother cells or devices. To facilitate efficient use of substrate area, awordline 120, which is not connected to the cell, is typically formedover the trench. Wordline 120 is referred to as the "passing wordline".As shown, the passing wordline is isolated from the trench by part ofthe STI. Such a configuration is referred to as a folded bitlinearchitecture. Other bitline architectures such as open or open-foldedare also useful.

Illustratively, the first conductivity is positive (p) and the secondconductivity is negative (n). However, those skilled in the art willappreciate that DRAM cells formed in a n-type substrate with p-type polyfilled trenches are also useful. Further, it is possible to heavily orlightly dope the substrate, wells, buried plate, and other elements ofthe DRAM cell with impurity atoms to achieve the desired electricalcharacteristics.

FIGS. 2a-2g depict a part of process of forming the conventional DRAMcell. Referring to FIG. 2a, a substrate 201 for forming the DRAM cell isprovided. The substrate comprises, for example, a silicon wafer. Othersubstrates such as gallium arsenide, germanium, silicon on insulator(SOI), or other semiconductor materials are also useful. The majorsurface of the substrate is not critical and any suitable orientationsuch as an (100), (110), or (111) is useful. The substrate, for example,may be lightly or heavily doped with dopants of a predeterminedconductivity to achieve the desired electrical characteristics. In anexemplary embodiment, the substrate is lightly doped with p-type dopants(p⁻). A pad stack 230 is formed on the surface of the substrate. The padstack comprises various layers functioning as an etch mask, etch stop,and/or chemical mechanical polish stop layers. Typically, the pad stackcomprises a pad oxide layer 231, nitride layer 232, and TEOS mask layer(not shown).

A trench 210 is formed in the substrate. Techniques for forming thetrench is described in, for example, Muller et al., Trench Storage NodeTechnology for Gigabit DRAM Generation, IEDM 96-507, which is alreadyherein incorporated by reference for all purposes. The trench is filledwith heavily doped n-type (n⁺) poly 214 (referred to as poly #1). The n⁺poly serves as one plate of the capacitors. A n⁺ buried plate 215surrounds the bottom portion of the trench and serves as the other plateof the capacitor. The trench and buried plate are isolated from eachother by a node dielectric layer 212. In one embodiment, the nodedielectric layer comprises nitride and oxide layers. In an upper portionof the trench, a collar 220 is formed. The collar comprises a dielectricmaterial such as, for example TEOS. Additionally, a buried N⁻ well 280is provided for connecting the other trenches in the array together.

FIG. 2a-b show the formation of the buried strap. As shown in FIG. 2a,the surface of the substrate have been polished by, for example,Chemical Mechanical Polishing (CMP). The nitride layer 232 serves as anCMP stop layer, causing the CMP to stop once it reaches the nitridelayer. As a result, the poly (referred to as poly #2) that covers thesurface of the substrate is planarized, leaving a substantially planarsurface between the nitride and poly for subsequent processing.

Referring to FIG. 2b, the formation of the strap for connecting thetrench to the transistor of the DRAM cell is shown. The poly isrecessed, by for example, reactive ion etching (RIE). Typically, thepoly is recessed to about 150 nm below the silicon surface. After thepoly is recessed, a clean step is performed to remove any native oxidethat may have formed on the silicon trench sidewall. The clean stepcomprises, for example, a wet etch selective to silicon. The clean stepremoves the oxide from the trench sidewalls as well as a to portion ofthe collar, recessing it below the N⁺ poly. As a result, a gap betweenthe silicon and poly sidewalls 225 and 227 is formed.

A poly layer 240 is deposited on the substrate, covering the nitridelayer and top portion of the trench. Typically, the poly layer is anintrinsic (or undoped) poly layer. The poly layer is planarized down tothe nitride layer 232. After planarization, the poly in the trench isrecessed to, for example, about 50 nm below the surface of thesubstrate, leaving a strap of about 100 nm above the n⁺ trench poly.

FIG. 2c shows the process for defining the active area of the DRAM cell.As shown, an anti-reflective coating (ARC) layer 245 is deposited on thesubstrate surface, covering the nitride layer 232 and strap 240. ARC isused to improve the resolution of the lithographic process for definingthe active area (AA). A resist layer 246 is formed above the ARC layer,serving as an AA etch mask. The active region is then defined byconventional lithographic technique. The nonactive region 250 of thecell is then anisotropically etched by, for example, RIE. As shown, thenonactive region overlaps a portion of the trench. Typically, thenonactive region is etched below the top of the oxide collar. By havingan opening, dopants in the trench poly are able to diffuse upward andoutward to form the buried strap which connects the inner plate of thecapacitor the trench to the transistor in a subsequent anneal. In oneembodiment, the nonactive region is etched about 250-400 nm below thesilicon surface. The nonactive region is the region where a STI is to beformed.

Referring to FIG. 2d, formation of the STI is shown. The resist and ARClayers are removed. To ensure that no resist or ARC residues remain,clean steps may be employed. Because several oxygen anneal are typicallyperformed thereafter, oxygen molecules can diffuse through the collaroxide and oxidize the trench poly and the silicon sidewalls of thetrench. Oxidation in the silicon sidewall and trench poly results inwhat is referred to as a bird's beak. Bird's beak causes stress andsilicon dislocations to form, adversely impacting the operability of thedevice. To prevent oxygen from diffusing into the silicon and polysidewalls, a nitride liner 255 is provided to protect the nonactiveregion. Typically, a passivation oxide is thermally grown on the exposedsilicon prior to forming the nitride liner. The nitride liner is formedby, for example low pressure chemical vapor deposition (LPCVD). Asshown, the nitride liner is formed over the substrate surface, coveringthe pad nitride layer and nonactive STI region.

Deposition of a dielectric material such as, for example, TEOS on thesurface of the substrate to sufficiently fill the nonactive region 250.Since the TEOS layer is conformal, a planarization scheme is employed toresult in a planar surface for subsequent processing. Such scheme, forexample, is described in Nag et al., Comparative Evaluation of Gap-FillDielectrics in Shallow Trench Isolation for Sub-0.25 μm Technologies,IEDM 96-841, which is herein incorporated by reference for all purposes.The surface of the substrate is polished so that the STI and nitridelayer are substantially planar.

FIG. 2e shows the process for forming the access transistor of the DRAMcell. As shown, the pad nitride layer is removed by, for example, wetchemical etch. The wet chemical etch is selective to oxide. To ensurethat the nitride layer is completely removed, an overetch is employed.During the overetch, the nitride liner at the top of the STI also getsrecessed, forming a divot 257. The pad oxide is also removed at thispoint by wet chemical selective to silicon. However, the divot formedduring the nitride etch exposes the oxide sidewalls on each side of thenitride liner. As such, the subsequent oxide etches further expand thedivot vertically along the sidwall of the active area.

Subsequently, in FIG. 2f, an oxide (not shown) layer is then formed onthe surface of the wafer. The oxide layer, referred to as a "gatesacrificial layer", serves as a screen oxide for subsequent implants.Additionally, the gate sacrificial layer rounds the STI corner.

To define a region for a p-type well 265 for the n-channel accesstransistor of the DRAM cell, a resist layer (not shown) is deposited ontop of the oxide layer and appropriately patterned to expose the P-wellregion.

P-type dopants, such as boron (B) are implanted into the well region.The dopants are implanted sufficiently deep to prevent punchthrough. Thedopant profile is tailored to achieve the desired electricalcharacteristics, e.g., gate threshold voltage (V_(t)).

In addition, p-wells for n-channel support circuitry are also formed.For complimentary wells in complimentary metal oxide silicon (CMOS)devices, n-wells are formed. Formation of n-wells require additionallithographic and implant steps for defining and forming the N wells. Aswith the p-wells, the profile of the n-wells are tailored to achieve thedesired electrical characteristics. After the wells have been form, thegate sacrificial layer is removed.

A gate oxidation layer 262 is formed and patterned to cover the regionwhere the transistor is to be formed. Poly 267, WSi_(x) 268, and nitride269 layers are then formed over the surface of the substrate. As can beseen, the divot is filled with poly as well. Referring to FIG. 2g, theselayers are then patterned to form a gate stack for a transistor 270 ofthe DRAM cell. A passing gate stack 280 is typically formed over thetrench and isolated therefrom by the STI-oxide. Drain 271 and source 272are formed by implanting dopants having the appropriate profile toachieve the desired operating characteristics. To improve diffusion andalignment of the source and drain to the gate, nitride spacers (notshown) may be employed. To connect the transistor to the trench, a strap273 is created by outdiffusing dopants from the strap poly 240.

As previously discussed, the divot 257 formed near the corner of theactive region adversely affects the operability of DRAM integratedcircuit, such as parasitic corner conduction.

FIG. 3 shows an illustrative embodiment of the invention. As shown, aDRAM cell comprises a trench capacitor 360 and a transistor 310. Sincethe trench capacitor is similar to that described in FIG. 1, only thetop portion is shown. Illustratively, the transistor 310 is a n-channeltransistor. The transistor includes a gate 312, source 313, and drain314. The drain and source are formed by implanting n-type dopants.Connection of the transistor to the capacitor is achieved via a dopedregion 325. The doped region is formed by diffusing n-type dopants fromthe trench. A dielectric collar 368 is provided to prevent verticalpunchthrough between the strap and buried plate (not shown).

In accordance with the invention, a raised STI is provided to isolatethe DRAM cell from other DRAM cells or devices. As shown, the depth ofthe raised STI is similar to that of a conventional STI. However, a topsurface of the raised STI is located above the plane of the siliconsubstrate surface. The distance that top surface is raised above thesubstrate surface is sufficient to effectively reduce formation ofdivots below the silicon surface in order to reduce corner reduction. Inone embodiment, the distance that the top surface of the raised STI israised is about <100 nm. Preferably, the distance is about 20-100 nm,more preferably about 40-80 nm, and even more preferably about 50-70 nm.In another embodiment, the distance that the top surface of the raisedSTI is raised is about 50 nm.

As previously discussed, the formation of divots results in parasiticcorner conduction. However, the present invention prevents the formationof divots by raising the surface of the STI above the substrate surface.Furthermore, as will be apparent, the use of the raised STIadvantageously eliminates the need of a nitride liner which alsocontributes to divot formation.

FIGS. 4a-4f show the process for forming a DRAM cell with a raised STI.Referring to FIG. 4a, a trench capacitor 410 is formed in a substrate401. In an exemplary embodiment, the substrate is lightly doped withp-type dopants (p⁻). Typically, a pad stack 430 is formed on the surfaceof the substrate. The pad stack comprises various layers that serve as aetch mask, etch stop, and/or chemical mechanical polish stop layers.Typically, the pad stack comprises a pad oxide layer 431, nitride layer432, and TEOS mask layer (not shown).

In one embodiment, the trench 410 is formed by conventional techniques.Such techniques are described in, for example, Nesbit et al., A 0.6 μm²256 Mb Trech DRAM Cell With Self-Aligned BuriEd Strap(BEST), IEDM93-627, which is already herein incorporated by reference for allpurposes. Illustratively, the trench is filled with N⁺ poly 414. In anupper portion of the trench, a collar 420 comprising a dielectricmaterial such as, for example TEOS, is provided. A layer of intrinsicpoly 440 is formed and recessed to above the collar and doped poly.Typically, the poly is recessed to, for example, about 50 nm below thesurface of the substrate, leaving a strap 440 of, for example, about 100nm above the N⁺ trench poly.

Referring to FIG. 4b, a layer of oxide is formed over the substratesurface, covering the pad stack and filling the opening above thetrench. In one embodiment, the oxide layer is formed by low pressurechemical vapor deposition (LPCVD). The oxide is densified. Densificationof the oxide is achieved by an anneal of about 900°-100° C. for about10-60 minutes in and inert ambient such as Argon or nitrogen. The CMPresults in a thin oxide layer 480 on top of the poly, providingisolation for the trench.

Subsequently, the pad nitride and pad oxide layers are removed by, forexample, a wet etch. A sacrificial oxide layer (not shown) is thenformed on the surface of the wafer. The oxide layer serves as a screenoxide layer for implants.

P-type well region for the n-channel access transistor of the DRAM cellis formed. This is achieved by, for example, depositing a resist layer(not shown) on top of the oxide layer and appropriately patterning it toexpose the p-well region. P-type dopants, such as boron (B) areimplanted into the well region. The dopants are implanted sufficientlydeep to prevent punchthrough. The dopant profile is tailored to achievethe desired electrical characteristics, e.g., gate threshold voltage(V_(t)). The different thermal budget on the well dopants due to thesubsequent raised STI passivation oxidation and oxide fill densificationanneal are taken into account when designing the desired dopantprofiles.

In addition, p-wells for n-channel support circuitry are also formed.For complimentary wells in complimentary metal oxide silicon (CMOS)devices, n-wells are formed. Formation of n-wells require additionallithographic and implant steps for defining and forming the n-wells. Aswith the P wells, the profile of the n-wells are tailored to achieve thedesired electrical characteristics. After the implants are completed,the screen oxide layer is removed by, for example, a wet etch.

Referring to FIG. 4c, a gate oxide layer 457 is formed over the activearea of the device. Poly layer 482 and nitride layer 483 aresequentially formed over the substrate surface after the creation of thegate oxide. The poly layer is sufficiently thick to offset the top ofthe subsequently formed raised STI oxide over the silicon substratesurface. In one embodiment, the poly layer is about 50 nm. The nitridelayer is sufficiently thick to serve as a polish stop. Typically, thenitride layer is about 100 nm thick.

FIG. 4d shows the process for defining the active area of the DRAM cell.The active area is defined using conventional lithographic techniques.After the areas are defined, the non-active region 450 isanisotropically etched by, for example, RIE. To improve the resolutionof the lithographic process, an anti-reflective layer may be used. Asshown, the non-active region overlaps a portion of the trench, leaving aremaining portion to permit a sufficient amount of current to flowbetween the transistor and capacitor. In one embodiment, the non-activeregion overlaps ≦ about half the trench width, preferably about half thetrench width. The non-active region is sufficiently deep to isolate theburied strap from the silicon sidewall opposite the side where thetransistor of the DRAM cell is to be formed. The non-active region isetched below the top of the oxide collar. In one embodiment, thenon-active region is etched about 250 nm below the silicon surface. Thenon-active region is the region where a raised STI is to be formed.

A dielectric material such as, for example, TEOS is deposited on thesurface of the substrate to sufficiently fill the nonactive region 450.Since the TEOS layer is conformal, planarization schemes utilizing, forexample, CMP, is performed to planarize the structure. Thereafter, thenitride layer is removed, resulting in the raised STI 455 having its topsurface planar with the top surface of the poly 482 layer. The removalof the nitride layer may cause a divot 490 to form. However, since theSTI is raised, the divot does not extend below the substrate surface. Asa result, corner conduction is reduced or eliminated, making V_(t) ofthe transistors more uniform.

Referring to FIG. 4e, a poly layer 483 is formed over the poly layer482. The combined thickness of the poly layers is sufficient to formedthe gate conductor. In one embodiment, the thickness of the combinedlayers is about 100 nm. Optionally, a silicide layer 484 comprisingrefractory metals, such as WSi_(x) to reduce the resistance of the gateconductor, is formed over the poly. A nitride layer 484 is formed abovethe polycide layer or, if no polycide layer is used, above the polylayer 483. The nitride layer serves as an etch stop for boarderlessbitline contact etch.

In FIG. 4f, the surface of the substrate is patterned to form a gatestack for a transistor 470 of the DRAM cell. A passing gate stack 480 istypically formed over the trench and isolated therefrom by the raisedSTI-oxide. Drain 471 and source 472 are formed by implanting dopantshaving the appropriate profile to achieve the desired operatingcharacteristics. To improve diffusion and alignment of the source anddrain to the gate, nitride spacers (not shown) may be employed.

Referring to FIG. 4, a typical computer system 400 is shown. As shown,the system includes a processor 410 which, for example, is amicroprocessor such as those produced by Intel. The processor performsarithmetical and logical operations as provided by the processor'sinstruction set. Computer programs and data are stored in the computersmemory storage 430. The memory storage includes magnetic or opticalmemory storage elements.

A keyboard 440 is provided to input commands to the system, as desiredby a user. Other input device such as a mouse for inputting instructionsby "point and click" technique may also be provided. The command, forexample, executes a computer program stored in the computer's storage.The computer program is then loaded into the computer's memory or RAM.The RAM includes DRAM ICs such as those described in the invention. Datastored in a data file located in the computer's storage and which isrequired for the execution of the computer program is also transferredto the computer's RAM. Additionally, the user inputs data as required ordesired, via the input device or devices.

Portion of the data and computer program that are recently or often usedare stored in the computer's high speed memory 415 known as the "cache".The cache, illustratively, is part of the processor. The results of theprogram are then provided to the user via a display 450.

While the invention has been particularly shown and described withreference to various embodiments, it will be recognized by those skilledin the art that modifications and changes may be made to the presentinvention without departing from the scope thereof. Merely by way ofexample, the illustrative embodiments of the invention have beendescribed with specific dimensions. These dimensions, however, areexemplary and may vary according to specific applications. The scope ofthe invention should therefore be determined not with reference to theabove description but with reference to the appended claims along withtheir full scope of equivalents.

What is claimed is:
 1. A computer system comprising:a memory, whereinthe memory includes a random access memory cell comprising: a trenchcapacitor, said trench capacitor formed beneath a major surface of asilicon substrate; a transistor comprising gate, source and drainregions, wherein said drain region of said transistor is electricallycoupled to said trench capacitor; and a raised shallow trench isolation(RSTI), said RSTI having a top surface that is above the major surfaceof the silicon substrate wherein the amount of the top surface of theRSTI above the major surface of the silicon is enough for protecting thesubstrate surface and for preventing a divot in the substrate surface.2. The computer system of claim 1 wherein the top surface of the RSTI isless than 100 nm above the silicon substrate.
 3. The computer system ofclaim 1 wherein the top surface of the RSTI is between 20-100 nm abovethe silicon substrate.
 4. The computer system of claim 1 wherein the topsurface of the RSTI is between 20-100 nm above the silicon substrate. 5.The computer system of claim 1 wherein the top surface of the RSTI isbetween 50-70 nm above the silicon substrate.
 6. The computer system ofclaim 1 wherein the top surface of the RSTI is at least 50 above thesilicon substrate.
 7. The computer system of claim 1 wherein the topsurface of the RSTI is above the substrate enough for preventingoxidation stress.
 8. The computer system of claim 1 wherein the topsurface of the RSTI is above the substrate enough for reducingconduction at the corners of the RSTI.